Appendix
APPENDIX ... 1
1. INFLUENCE OF THE STEADY-STATE AND THE TRANSIENT THERMAL ANALYSIS ... 3
1.1. Stress caused by Uniform Temperature Variation from 80 ° C to -40 ° C in Various Times in Assemblies with Potting Compound RAPID Y16 ... 3
1.2. Stress caused by Uniform Temperature Variation from 80 ° C to -40 ° C in Various Time in Assemblies without Potting Compound ... 5
2. INFLUENCE OF TYPE OF THE POTTING COMPOUND ... 7
2.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C ... 7
2.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C ... 9
2.3. Stress Caused by Uniform Temperature Variation from 20°C to -40 °C ... 11
3. INFLUENCE OF HEIGHT OF THE LAYER OF THE POTTING COMPOUND INSIDE POTTED PCB ASSEMBLY ... 13
3.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C ... 13
3.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C ... 15
4. INFLUENCE OF DISTANCES BETWEEN FRONT EDGES OF CONSECUTIVELY POSITIONED SMDS INSIDE PCB ASSEMBLY POTTED BY RAPID Y16 ... 17
4.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C ... 17
4.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C ... 19
5. INFLUENCE OF DISTANCES BETWEEN LATERAL SIDES OF SMDS INSIDE POTTED PCB ASSEMBLY ... 21
5.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C ... 21
5.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C ... 23
6. INFLUENCE OF DISTANCE BETWEEN FRONT EDGE OF PADS OF SMDS AND THE SHELL INSIDE POTTED PCB ASSEMBLY ... 25
6.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C ... 25
6.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C ... 27
7. INFLUENCE OF DISTANCE BETWEEN LATERAL SIDE OF SMDS AND THE SHELL INSIDE POTTED PCB ASSEMBLY ... 29
7.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C ... 29
7.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C ... 31
8. INFLUENCE OF SHELL ... 33
8.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C ... 33
8.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C ... 33
1. Influence of the Steady-State and the Transient Thermal Analysis
1.1. Stress caused by Uniform Temperature Variation from 80 ° C to -40 ° C in Various Times in Assemblies with Potting Compound RAPID Y16
Figure 1 Maximum equivalent stress safety factor of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40 °C (steady-state thermal
analysis) in time 1800s
Figure 2 Mohr’s safety factor of SMD – loaded by ramp temperature variation of overall body from 80 °C to -40
°C (steady-state thermal analysis) in time 1800s
Figure 3 Temperature of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40
°C (steady-state thermal analysis) in time 1800 s
Figure 4 Maximum equivalent stress safety factor of assembly – loaded by step change of ambient temperature from 80 °C to -40 °C (transient thermal
analysis) in time 1800 s
Figure 5 Mohr’s safety factor of SMD – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 1800 s
Figure 6 Temperature of assembly – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 1800 s
Figure 7 Maximum equivalent stress safety factor of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40 °C (steady-state thermal
analysis) in time 949 s
Figure 8 Mohr’s safety factor of SMD – loaded by ramp temperature variation of overall body from 80 °C to -40
°C (steady-state thermal analysis) in time 949 s
Figure 9 Temperature of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40
°C (steady-state thermal analysis) in time 949 s
Figure 10 Maximum equivalent stress safety factor of assembly – loaded by step change of ambient temperature from 80 °C to -40 °C (transient thermal
analysis) in time 200 s
Figure 11 Mohr’s safety factor of SMD – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 200 s
Figure 12 Temperature of assembly – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 200 s thermal analysis) in time 200 s
Figure 13 Stress of solder – loaded by ramp temperature variation of overall body from 80 °C to -40 °C (steady-state thermal analysis) in time 1800 s
Figure 14 Stress of solder – loaded by step change of ambient temperature from 80 °C to -40 °C (transient
thermal analysis) in time 1800 s
Figure 15 Stress of solder – loaded by ramp temperature variation of overall body from 80 °C to
-40 °C (steady-state thermal analysis) in time 949 s
Figure 16 Stress of solder – loaded by step change of ambient temperature from 80 °C to -40 °C (transient
thermal analysis) in time 200 s
1.2. Stress caused by Uniform Temperature Variation from 80 ° C to -40 ° C in Various Time in Assemblies without Potting Compound
Figure 17 Maximum equivalent stress safety factor of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40 °C (steady-state thermal
analysis) in time 1800s
Figure 18 Mohr’s safety factor of SMD – loaded by ramp temperature variation of overall body from 80 °C to -40
°C (steady-state thermal analysis) in time 1800s
Figure 19 Temperature of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40 °C (steady-state thermal analysis) in time 1800 s
Figure 20 Maximum equivalent stress safety factor of assembly – loaded by step change of ambient temperature
from 80 °C to -40 °C (transient thermal analysis) in time 1800 s
Figure 21 Mohr’s safety factor of SMD – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 1800 s
Figure 22 Temperature of assembly – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 1800 s
Figure 23 Maximum equivalent stress safety factor of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40 °C (steady-state thermal
analysis) in time 1252 s
Figure 24 Mohr’s safety factor of SMD – loaded by ramp temperature variation of overall body from 80 °C to -40
°C (steady-state thermal analysis) in time 1252 s
Figure 25 Temperature of assembly – loaded by ramp temperature variation of overall body from 80 °C to -40 °C (steady-state thermal analysis) in time 1252 s
Figure 26 Maximum equivalent stress safety factor of assembly – loaded by step change of ambient temperature
from 80 °C to -40 °C (transient thermal analysis) in time 40 s
Figure 27 Mohr’s safety factor of SMD – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 40 s
Figure 28 Temperature of assembly – loaded by step change of ambient temperature from 80 °C to -40 °C
(transient thermal analysis) in time 40 s
Figure 29 Stress of solder – loaded by ramp temperature variation of overal body from 80 °C to -40
°C (steady-state thermal analysis) in time 1800 s
Figure 30 Stress of solder – loaded by step change of ambient temperature from 80 °C to -40 °C (transient
thermal analysis) in time 1800
Figure 31 Stress of solder – loaded by ramp temperature variation of overal body from 80 °C to -40
°C (steady-state thermal analysis) in time 1252 s
Figure 32 Stress of solder – loaded by step change of ambient temperature from 80 °C to -40 °C (transient
thermal analysis) in time 40 s
2. Influence of Type of the Potting Compound
2.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C
Figure 33: Maximum equivalent stress safety factor of assembly without potting
Figure 34: Mohr’s safety factor of SMD without potting
Figure 35: Stress of solder in the assembly without potting
Figure 36: Maximum equivalent stress safety factor of assembly with RAPID Y16
Figure 37: Mohr’s safety factor of SMD with RAPID Y16
Figure 38: Stress of solder in the assembly with RAPID Y16
Figure 39: Maximum equivalent stress safety factor of assembly with RAPID 3010
Figure 40: Mohr’s safety factor of SMD with RAPID 3010
Figure 41: Stress of solder in the assembly with RAPID Y16
Figure 42: Maximum equivalent stress safety factor of assembly with RAPID 3020
Figure 43: Mohr’s safety factor of SMD with RAPID 3020
Figure 44: Stress of solder in the assembly with RAPID 3020
Figure 45: Stress of SMD in the assembly without potting
Figure 46: Total strain of the solder in the assembly without potting compound
Figure 47: Stress of SMD in the assembly with RAPID Y16
Figure 48: Total strain of the solder in the assembly with RAPID Y16
Figure 49: Stress of SMD in the assembly with RAPID 3010
Figure 50: Total strain of the solder in the assembly with 3010
Figure 51: Stress of SMD in the assembly with RAPID 3020
Figure 52: Total strain of the solder in the assembly with 3020
2.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C
Figure 53: Maximum equivalent stress safety factor of assembly without potting
Figure 54: Mohr’s safety factor of SMD without potting
Figure 55: Stress of solder in the assembly without potting
Figure 56: Maximum equivalent stress safety factor of assembly with RAPID Y16
Figure 57: Mohr’s safety factor of SMD with RAPID Y16
Figure 58: Stress of solder in the assembly with RAPID Y16
Figure 59: Maximum equivalent stress safety factor of assembly with RAPID 3010
Figure 60: Mohr’s safety factor of SMD with RAPID 3010
Figure 61: Stress of solder in the assembly with RAPID 3010
Figure 62: Maximum equivalent stress safety factor of assembly with RAPID 3020
Figure 63: Mohr’s safety factor of SMD with RAPID 3020
Figure 64: Stress of solder in the assembly with RAPID 3020
Figure 65: Stress of SMD in the assembly without potting
Figure 66: Total strain of the solder in the assembly without potting compound
Figure 67: Stress of SMD in the assembly with RAPID Y16
Figure 68: Total strain of the solder in the assembly with RAPID Y16
Figure 69: Stress of SMD in the assembly with RAPID 3010
Figure 70: Total strain of the solder in the assembly with RAPID 3010
Figure 71: Stress of SMD in the assembly with RAPID 3020
Figure 72: Total strain of the solder in the assembly with RAPID 3020
2.3. Stress Caused by Uniform Temperature Variation from 20°C to -40 °C
Figure 73: Maximum equivalent stress safety factor of assembly without potting
Figure 74: Mohr’s safety factor of SMD without potting
Figure 75: Stress of solder in the assembly without potting
Figure 76: Maximum equivalent stress safety factor of assembly with RAPID Y16
Figure 77: Mohr’s safety factor of SMD with RAPID Y16
Figure 78: Stress of solder in the assembly with RAPID Y16
Figure 79: Maximum equivalent stress safety factor of assembly with RAPID 3010
Figure 80: Mohr’s safety factor of SMD with RAPID 3010
Figure 81: Stress of solder in the assembly with RAPID 3010
Figure 82: Maximum equivalent stress safety factor of assembly with RAPID 3020
Figure 83: Mohr’s safety factor of SMD with RAPID 3020
Figure 84: Stress of solder in the assembly with RAPID 3020
Figure 85: Stress of SMD in the assembly without potting
Figure 86: Total strain of the solder in the assembly without potting compound
Figure 87: Stress of SMD in the assembly with RAPID Y16
Figure 88: Total strain of the solder in the assembly with RAPID Y16
Figure 89: Stress of SMD in the assembly with RAPID 3010
Figure 90: Total strain of the solder in the assembly with RAPID 3010
Figure 91: Stress of SMD in the assembly with RAPID 3020
Figure 92: Total strain of the solder in the assembly with RAPID 3020
3. Influence of Height of the Layer of the Potting Compound inside Potted PCB Assembly 3.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C
Figure 93: Maximum equivalent stress safety factor of assembly with 6 mm height of upper layer of potting compound
Figure 94: Detail of maximum equivalent stress safety factor of assembly with 6 mm height of upper layer of potting compound
Figure 95: Detail of Mohr’s safety factor of SMD with 6 mm height of upper layer of potting compound
Figure 96: Maximum equivalent stress safety factor of assembly with 3 mm height of upper layer of potting compound
Figure 97: Detail of maximum equivalent stress safety factor of assembly with 3 mm height of upper layer of potting compound
Figure 98: Detail of Mohr’s safety factor of SMD with 3 mm height of upper layer of potting compound
Figure 99: Maximum equivalent stress safety factor of assembly with 1.5 mm height of upper layer of potting compound
Figure 100: Detail of maximum equivalent stress safety factor of assembly with 1.5 mm height of upper layer of potting compound
Figure 101: Detail of Mohr’s safety factor of SMD with 1.5 mm height of upper layer of potting compound
Figure 102: Stress of solder with 6 mm height of upper layer of potting compound
Figure 103: Stress of SMD with 6 mm height of upper layer of potting compound
Figure 104: Total strain of the solder with 6 mm height of upper layer of potting compound
Figure 105: Stress of assembly with 3 mm height of upper layer of potting compound
Figure 106: Stress of SMD with 3 mm height of upper layer of potting compound
Figure 107: Total strain of the solder with 3 mm height of upper layer of potting compound
Figure 108: Stress of assembly with 1.5 mm height of upper layer of potting compound
Figure 109: Stress of SMD with 1.5 mm height of upper layer of potting compound
Figure 110: Total strain of the solder with 1.5 mm height of upper layer of potting compound
3.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C
Figure 111: Safety factor of assembly with 6 mm height of upper layer of potting compound
Figure 112: Detail of maximum equivalent stress safety factor of assembly with 6 mm height of upper layer of potting compound
Figure 113: Detail of Mohr’s safety factor of SMD with 6 mm height of upper layer of potting compound
Figure 114: Safety factor of assembly with 3 mm height of upper layer of potting compound
Figure 115: Detail of maximum equivalent stress safety factor of assembly with 3 mm height of upper layer of potting compound
Figure 116: Detail of Mohr’s safety factor of SMD with 3 mm height of upper layer of potting compound
Figure 117: Safety factor of assembly with 1.5 mm height of upper layer of potting compound
Figure 118: Detail of maximum equivalent stress safety factor of assembly with 1.5 mm height of upper layer of potting compound
Figure 119: Detail of Mohr’s safety factor of SMD with 1.5 mm height of upper layer of potting compound
Figure 120: Stress of solder with 6 mm height of upper layer of potting compound
Figure 121: Stress of SMD with 6 mm height of upper layer of potting compound
Figure 122: Total strain of the solder with 6 mm height of upper layer of potting compound
Figure 123: Stress of solder with 3 mm height of upper layer of potting compound
Figure 124: Stress of SMD with 3 mm height of upper layer of potting compound
Figure 125: Total strain of the solder with 3 mm height of upper layer of potting compound
Figure 126: Stress of solder with 1.5 mm height of upper layer of potting compound
Figure 127: Stress of SMD with 1.5 mm height of upper layer of potting compound
Figure 128: Total strain of the solder with 1.5 mm height of upper layer of potting compound
4. Influence of Distances between Front Edges of Consecutively Positioned SMDs inside PCB Assembly potted by Rapid Y16 4.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C
Figure 129: Maximum equivalent stress safety factor of SMDs with 0.1 mm distance between them
Figure 130: Mohr’s safety factor of SMDs with 0.1 mm distance between them
Figure 131: Stress of solders with 0.1 mm distance between them
Figure 132: Maximum equivalent stress safety factor of SMDs with 1 mm distance between them
Figure 133: Mohr’s safety factor of SMDs with 1 mm distance between them
Figure 134: Stress of solders with 1 mm distance between them
Figure 135: Maximum equivalent stress safety factor of SMDs with 3 mm distance between them
Figure 136: Mohr’s safety factor of SMDs with 3 mm distance between them
Figure 137: Stress of solders with 3 mm distance between the
Figure 138: Maximum equivalent stress safety factor of SMDs with 6 mm distance between them
Figure 139: Mohr’s safety factor of SMDs with 6 mm distance between them
Figure 140: Stress of solders with 6 mm distance between them
Figure 141: Stress of SMDs with 0.1 mm distance between them
Figure 142: Stress of SMDs with 1 mm distance between them
Figure 143: Stress of SMDs with 3 mm distance between them
Figure 144: Stress of SMDs with 6 mm distance between them
4.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C
Figure 145: Maximum equivalent stress safety factor of assembly with 0.1 mm distance between them
Figure 146: Mohr’s safety factor of SMDs with 0.1 mm distance between them
Figure 147: Stress of solders with 0.1mm distance between them
Figure 148: Maximum equivalent stress safety factor of assembly with 1 mm distance between them
Figure 149: Mohr’s safety factor of SMDs with 1 mm distance between them
Figure 150: Stress of solders with 1 mm distance between them
Figure 151: Maximum equivalent stress safety factor of assembly with 3 mm distance between them
Figure 152: Mohr’s safety factor of SMDs with 3 mm distance between them
Figure 153: Stress of solders with 3 mm distance between them
Figure 154: Maximum equivalent stress safety factor of assembly with 6 mm distance between them
Figure 155: Mohr’s safety factor of SMDs with 6 mm distance between them
Figure 156: Stress of solders with 6 mm distance between them
Figure 157: Stress of SMDs with 0.1 mm distance between them
Figure 158: Stress of SMDs with 1 mm distance between them
Figure 159: Stress of SMDs with 3 mm distance between them
Figure 160: Stress of SMDs with 6 mm distance between them
5. Influence of Distances between Lateral Sides of SMDs inside Potted PCB Assembly 5.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C
Figure 161: Maximum equivalent stress safety factor of assembly with 0.5 mm distance between them
Figure 162: Mohr’s safety factor of SMDs with 0.5 mm distance between them
Figure 163: Stress of solders with 0.5 mm distance between them
Figure 164: Maximum equivalent stress safety factor of assembly with 1 mm distance between them
Figure 165: Mohr’s safety factor of SMDs with 1 mm distance between them
Figure 166: Stress of solders with 1 mm distance between them
Figure 167: Maximum equivalent stress safety factor of assembly with 3 mm distance between them
Figure 168: Mohr’s safety factor of SMDs with 3 mm distance between them
Figure 169: Stress of solders with 3 mm distance between them
Figure 170: Maximum equivalent stress safety factor of assembly with 6 mm distance between them
Figure 171: Mohr’s safety factor of SMDs with 6 mm distance between them
Figure 172: Stress of solders with 6 mm distance between them
Figure 173: Stress of SMDs with 0.5 mm distance between them
Figure 174: Stress of SMDs with 1 mm distance between them
Figure 175: Stress of SMDs with 3 mm distance between them
Figure 176: Stress of SMDs with 6 mm distance between them
5.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C
Figure 177: Maximum equivalent stress factor of assembly with 0.5 mm distance between them
Figure 178: Mohr’s safety factor of SMDs with 0.5 mm distance between them
Figure 179: Stress of solders with 0.5 mm distance between them
Figure 180: Maximum equivalent stress factor of assembly with 1 mm distance between them
Figure 181: Mohr’s safety factor of SMDs with 1 mm distance between them
Figure 182: Stress of solders with 1 mm distance between them
Figure 183: Maximum equivalent stress factor of assembly with 3 mm distance between them
Figure 184: Mohr’s safety factor of SMDs with 3 mm distance between them
Figure 185: Stress of solders with 3 mm distance between them
Figure 186: Maximum equivalent stress factor of assembly with 6 mm distance between them
Figure 187: Mohr’s safety factor of SMDs with 6 mm distance between them
Figure 188: Stress of solders with 6 mm distance between them
Figure 189: Stress of SMDs with 0.5 mm distance between them
Figure 190: Stress of SMDs with 1 mm distance between them
Figure 191: Stress of SMDs with 3 mm distance between them
Figure 192: Stress of SMDs with 6 mm distance between them
6. Influence of Distance between Front Edge of Pads of SMDs and the Shell inside Potted PCB Assembly 6.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C
Figure 193: Maximum equivalent stress safety factor of assembly with 0.1 mm distance between edge of
solder and shell
Figure 194: Mohr’s safety factor of SMDs with 0.1 mm distance between edge of solder and shell
Figure 195: Stress of solders with 0.1 mm distance between edge of solder and shell
Figure 196: Maximum equivalent stress safety factor of assembly with 1 mm distance between edge of
solder and shell
Figure 197: Mohr’s safety factor of SMDs with 1 mm distance between edge of solder and shell
Figure 198: Stress of solders with 1 mm distance between edge of solder and shell
Figure 199: Maximum equivalent stress safety factor of assembly with 3 mm distance between edge of
solder and shell
Figure 200: Mohr’s safety factor of SMDs with 3 mm distance between edge of solder and shell
Figure 201: Stress of solders with 3 mm distance between edge of solder and shell
Figure 202: Maximum equivalent stress safety factor of assembly with 6 mm distance between edge of
solder and shell
Figure 203: Mohr’s safety factor of SMDs with 6 mm distance between edge of solder and shell
Figure 204: Stress of solders with 6 mm distance between edge of solder and shell
between edge of solder and shell between edge of solder and shell between edge of solder and shell between edge of solder and shell
6.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C
Figure 209: Maximum equivalent stress factor of assembly with 0.1 mm distance between edge of
solder and shell
Figure 210: Mohr’s safety factor of SMDs with 0.1 mm distance between edge of solder and shell
Figure 211: Stress of solders with 0.1 mm distance between edge of solder and shell
Figure 212: Maximum equivalent stress factor of assembly with 1 mm distance between edge of solder
and shell
Figure 213: Mohr’s safety factor of SMDs with 1 mm distance between edge of solder and shell
Figure 214: Stress of solders with 1 mm distance between edge of solder and shell
Figure 215: Maximum equivalent stress factor of assembly with 3 mm distance between edge of solder
and shell
Figure 216: Mohr’s safety factor of SMDs with 3 mm distance between edge of solder and shell
Figure 217: Stress of solders with 3 mm distance between edge of solder and shell
Figure 218: Maximum equivalent stress factor of assembly with 6 mm distance between edge of solder
and shell
Figure 219: Mohr’s safety factor of SMDs with 6 mm distance between edge of solder and shell
Figure 220: Stress of solders with 6 mm distance between edge of solder and shell
Figure 221: Stress of SMDs with 0.1 mm distance between edge of solder and shell
Figure 222: Stress of SMDs with 1 mm distance between edge of solder and shell
Figure 223: Stress of SMDs with 3 mm distance between edge of solder and shell
Figure 224: Stress of SMDs with 6 mm distance between edge of solder and shell
7. Influence of Distance between Lateral Side of SMDs and the Shell inside Potted PCB Assembly 7.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C
Figure 225: Maximum equivalent stress safety factor of assembly with 0.1 mm distance between edge of
SMD and shell
Figure 226: Mohr’s safety factor of SMDs with 0.1 mm distance between edge of SMD and shell
Figure 227: Stress of solders with 0.1 mm distance between edge of SMD and shell
Figure 228: Maximum equivalent stress safety factor of assembly with 1 mm distance between edge of
SMD and shell
Figure 229: Mohr’s safety factor of SMDs with 1 mm distance between edge of SMD and shell
Figure 230: Stress of solders with 1 mm distance between edge of SMD and shell
Figure 231: Maximum equivalent stress safety factor of assembly with 3 mm distance between edge of
SMD and shell
Figure 232: Mohr’s safety factor of SMDs with 3 mm distance between edge of SMD and shell
Figure 233: Stress of solders with 3 mm distance between edge of SMD and shell
Figure 234: Maximum equivalent stress safety factor of assembly with 6 mm distance between edge of
SMD and shell
Figure 235: Mohr’s safety factor of SMDs with 6 mm distance between edge of SMD and shell
Figure 236: Stress of solders with 6 mm distance between edge of SMD and shell
Figure 237: Stress of SMDs with 0.1 mm distance between edge of SMD and shell
Figure 238: Stress of SMDs with 1 mm distance between edge of SMD and shell
Figure 239: Stress of SMDs with 3 mm distance between edge of SMD and shell
Figure 240: Stress of SMDs with 6 mm distance between edge of SMD and shell
7.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C
Figure 241: Maximum equivalent stress safety factor of assembly with 0.1 mm distance between edge of
SMD and shell
Figure 242: Mohr’s safety factor of SMDs with 0.1 mm distance between edge of SMD and shell
Figure 243: Stress of solders with 0.1 mm distance between edge of SMD and shell
Figure 244: Maximum equivalent stress safety factor of assembly with 1 mm distance between edge of
SMD and shell
Figure 245: Mohr’s safety factor of SMDs with 1 mm distance between edge of SMD and shell
Figure 246: Stress of solders with 1 mm distance between edge of SMD and shell
Figure 247: Maximum equivalent stress safety factor of assembly with 3 mm distance between edge of
SMD and shell
Figure 248: Mohr’s safety factor of SMDs with 3 mm distance between edge of SMD and shell
Figure 249: Stress of solders with 3 mm distance between edge of SMD and shell
Figure 250: Maximum equivalent stress safety factor of assembly with 6 mm distance between edge of
SMD and shell
Figure 251: Mohr’s safety factor of SMDs with 6 mm distance between edge of SMD and shell
Figure 252: Stress of solders with 6 mm distance between edge of SMD and shell
Figure 253: Stress of SMDs with 0.1 mm distance between edge of SMD and shell
Figure 254: Stress of SMDs with 1 mm distance between edge of SMD and shell
Figure 255: Stress of SMDs with 3 mm distance between edge of SMD and shell
Figure 256: Stress of SMDs with 6 mm distance between edge of SMD and shell
8. Influence of Shell
8.1. Stress Caused by Uniform Temperature Variation from 80°C to -40 °C 8.2. Stress Caused by Uniform Temperature Variation from 20°C to 80 °C
Figure 257: Maximum equivalent stress safety factor of assembly with Rapid Y16 potting compound and
without shell
Figure 258: Detail of maximum equivalent stress safety factor of assembly with Rapid Y16 potting
compound and without shell
Figure 259: Detail of Mohr’s safety factor of SMD with Rapid Y16 potting compound and without shell
Figure 260: Stress of solder in assembly with Rapid Y16 potting compound and without shell
Figure 261: Stress of SMD in assembly with Rapid Y16 potting compound and without shell
Figure 262: Total strain of solder in assembly with Rapid Y16 potting compound and without shell
Figure 263: Maximum equivalent stress safety factor of assembly with Rapid Y16 potting compound and
without shell
Figure 264: Detail of maximum equivalent stress safety factor of assembly with Rapid Y16 potting
compound and without shell
Figure 265: Detail of Mohr’s safety factor of SMD with Rapid Y16 potting compound and without shell
Figure 266: Stress of solder in assembly with Rapid Y16 potting compound and without shell
Figure 267: Stress of SMD in assembly with Rapid Y16 potting compound and without shell
Figure 268: Total strain of solder in assembly with Rapid Y16 potting compound and without shell
