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Micromachined Cavity Resonator Sensor for on Chip Material Characterisation at 260 GHz

Dragos Dancila

#

, Bernhard Beuerle

*

, Umer Shah

*

, Anders Rydberg

#

, Joachim Oberhammer

*

#

Microwave group, Division of Solid-State Electronics, Uppsala University, SE-751 21 Uppsala, Sweden

*

Micro and Nanosystems, Royal Institute of Technology (KTH), SE-100 44 Stockholm, Sweden dragos.dancila@angstrom.uu.se

I. INTRODUCTION

The characterization of dielectric properties in the J-band (220–330 GHz) is necessary for different applications such as dielectric heating, remote sensing, molecular detection and could also be used for measurements of the sheet re- sistance and conductivity of thin films [1]. Typically, cavity resonators are used for dielectric characterization, as their high Q factor allows achieving a high sensitivity to the per- mittivity of the material under test (MUT) [2]. In this paper, we present a two-port cavity resonator filter at 260 GHz used for dielectric characterization and show the response of the sensor on different probed materials.

II. DESIGN

The silicon waveguide height is 285 µm and its width is 864 µm. The cavity is 750 µm long and a square aperture of 250 µm by 250 µm protrudes the top wall. A two-port cavity resonator filter is designed for 260 GHz. The coupling co- efficient is adjusted for critical coupling using HFSS simu- lations. Changing the opening width, here 560µm, see Fig.1, a critical coupling of the cavity resonator is achieved when the cavity is evanescently coupled to the MUT.

Fig.1: Two-port waveguide sensor with E field and fring- ing fields coupling to the material under test (MUT).

III. FABRICATION AND ASSEMBLY

The cavity sensor was fabricated in a low-loss microm- achined waveguide technology developed at KTH, consist- ing of a 285 μm thick silicon-wafer etched by deep-reactive ion etching, using a silicon dioxide mask. The wafers are metallized by gold sputtering of 1 μm and the assembly is realized using thermocompression bonding. More details on the fabrication process could be found in [3].

IV. RESULTS

Measurements were conducted using a Rohde&Schwarz ZVA24 Vector Network Analyzer with two ZC330 TxRx millimetre-wave extenders in the band 220-330 GHz. A TRL calibration was carried out, using a micromachined calibration kit implemented on the same chip containing the

sensor. The micromachined TRL calibration kit allows for de- embedding the reference planes located inside the microm- achined rectangular waveguides, i.e., directly adjacent to the two-port waveguide sensor, shown in Fig. 1.

Fig.2: Phase extracted from S

21

measurements, as follows:

black line – air; green line – RO3003; grey line – Al

2

O

3

; orange line – SiHR and pink line – dielectric permittivity 30.

Measurements are performed on different dielectric mate- rials, MUT is placed on top of the sensing area and S param- eters are measured. The phase of S

21

is present in Fig. 2 for different materials. For increasingly higher permittivities, we observe an increase in the phase shift of S

21

. The materials probed, as follows (in bracket known permittivity at lower frequencies e.g. 10 GHz): black – air (epsr = 1); green – RO3003 (epsr = 3); grey – Al

2

O

3

(epsr = 9); orange – SiHR (epsr = 11.9) and pink – dielectric material (epsr = 30).

V. CONCLUSIONS

A silicon micromachined waveguide sensor at 260 GHz is used to measure dielectric materials. A good correlation be- tween permittivity at lower frequencies and phase shift at 260 GHz is observed. The sensor is well suited to implement on chip material dielectric characterisation at J-band.

VI. ACKNOWLEDGEMENT

Work is supported by the Swedish Foundation for Strategic Research (SSF) with Synergy Grant Electronics SE13-007.

REFERENCES

[1] A. H. Sklavounos and N. S. Barker, "Liquid-Permittivity Measurements Using a Rigorously Modeled Overmoded Cavity Resonator," in IEEE Transactions on Microwave Theory and Techniques, vol. 62, no. 6, pp. 1363-1372, June 2014.

[2] D. Dancila et al.“Micromachined Cavity Resonator Sensors for on Chip Material Characterisation in the 220–330 GHz band,” EUMC, Nurnberg, Oct. 2017.

[3] Beuerle, B. (2018) A Very Low Loss 220–325 GHz Silicon

Micromachined Waveguide Technology. IEEE Transactions on

Terahertz Science and Technology.

References

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