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Design of Millimeter-wave SiGe Frequency Doubler and

Output Buffer for Automotive Radar Applications

Master thesis performed at Acreo AB

in collaboration with Division of Electronic Devices,

Dept. of Electrical Engineering, Linköping University

by

Amjad Altaf

Report number: LiTH-ISY-EX--07/3978--SE February 2007

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Title

Design of Millimeter-wave SiGe Frequency Doubler and

Output Buffer for Automotive Radar Applications

Master thesis in Division of Devices

Department of Electrical Engineering

Linköping University, Sweden

by

Amjad Altaf

LiTH-ISY-EX--07/3978--SE

Supervisor:

Darius Jakonis (Acreo AB, Norrköping)

Examiner: Jerzy Dabrowski (ISY)

Linköping: February 2007

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Presentation Date

2007-02-08

Publishing Date (Electronic version) 2007-02-15 Division of Electronics Systems Department of Electrical Engineering Abstract

Automotive Radars have introduced various functions on automobiles for driver’s safety and comfort, as part of the Intelligent Transportation System (ITS) including Adaptive Cruise Control (ACC), collision warning or avoidance, blind spot surveillance and parking assistance. Although such radar systems with 24 GHz carrier frequency are already in use but due to some regulatory issues, recently a permanent band has been allocated at 77-81 GHz, allowing for long-term development of the radar service. In fact, switchover to the new band is mandatory by 2014.

A frequency multiplier will be one of the key components for such amillimeter wave automotive radar system because there are limitations in direct implementation of low phase noise oscillators at high frequencies. A practical way to build a cost-effective and stable source at higher frequency is to use an active multiplier preceded by a high spectral purity VCO operating at a lower frequency. Recent improvements in the performance of SiGe technology allow the silicon microelectronics to advance into areas previously restricted to compound semiconductor devices and make it a strong competitor for automotive radar applications at 79 GHz.

This thesis presents the design of active frequency doubler circuits at 20 GHz in a commercially available SiGe BiCMOS technology and at 40GHz in SiGe bipolar technology (Infineon-B7h200 design). Buffer/amplifier circuits are included at output VWDJHVWRGULYH ORDG7KHIUHTXHQF\GRXEOHUDW*+]LVEDVHGon an emitter-coupled pair operating in class-B configuration at 1.8 V supply voltage. Pre-layout simulations show its conversion gain of 10 dB at -5 dBm input, fundamental suppression of G%DQG1)RIG%,QSXWDQGRXWSXWLPSHGDQFHPDWFKLQJQHWZRUNVDUHGHVLJQHGWRPDWFK DWERWKVLGHV

The millimeter wave frequency doubler is designed for 5 V supply voltage and has the Gilbert cell-based differential architecture where both RF and LO ports are tied together to act as a frequency doubler. Both pre-layout and post-layout simulation results are presented and compared together. The extracted circuit has a conversion gain of 8 dB at -8 dB input, fundamental suppression of 20 dB, NF of 12 dB and it consumes 42 mA current from supply. The layout occupies an area of 0.12 mm2 without pads and baluns

at both input and output ports. The frequency multiplier circuits have been designed using Cadence Design Tool.

Number of pages: 88

ISBN (Licentiate thesis) ISRN: LiTH-ISY-EX--07/3978—SE Title of series (Licentiate thesis) Series number/ISSN (Licentiate thesis) Language English Number of Pages 88 Type of Publication Licentiate thesis ” Degree thesis Thesis C-level Thesis D-level Report

Other (specify below)

Publication Title

Design of millimeter-wave SiGe frequency doubler and output buffer for automotive radar applications

Author

Amjad Altaf

URL, Electronic Version

http://www.ep.liu.se

Keywords

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Abstract

Automotive Radars have introduced various functions on automobiles for driver’s safety and comfort, as part of the Intelligent Transportation System (ITS) including Adaptive Cruise Control (ACC), collision warning or avoidance, blind spot surveillance and parking assistance. Although such radar systems with 24 GHz carrier frequency are already in use but due to some regulatory issues, recently a permanent band has been allocated at 77-81 GHz, allowing for long-term development of the radar service. In fact, switchover to the new band is mandatory by 2014. A frequency multiplier will be one of the key components for such a millimeter wave automotive radar system because there are limitations in direct implementation of low phase noise oscillators at high frequencies. A practical way to build a cost-effective and stable source at higher frequency is to use an active multiplier preceded by a high spectral purity VCO operating at a lower frequency. Recent improvements in the performance of SiGe technology allow the silicon microelectronics to advance into areas previously restricted to compound semiconductor devices and make it a strong competitor for automotive radar applications at 79 GHz.

This thesis presents the design of active frequency doubler circuits at 20 GHz in a commercially available SiGe BiCMOS technology and at 40GHz in SiGe bipolar technology (Infineon-B7h200 design). Buffer/amplLILHUFLUFXLWVDUHLQFOXGHGDWRXWSXWVWDJHVWRGULYH ORDG The frequency doubler at 20 GHz is based on an emitter-coupled pair operating in class-B configuration at 1.8 V supply voltage. Pre-layout simulations show its conversion gain of 10 dB at -5 dBm input, fundamental suppression of 25dB and NF of 12dB. Input and output LPSHGDQFHPDWFKLQJQHWZRUNVDUHGHVLJQHGWRPDWFK DWERWKVLGHV The millimeter wave frequency doubler is designed for 5 V supply voltage and has the Gilbert cell-based differential architecture where both RF and LO ports are tied together to act as a frequency doubler. Both pre-layout and post-layout simulation results are presented and compared together. The extracted circuit has a conversion gain of 8 dB at -8 dB input, fundamental suppression of 20 dB, NF of 12 dB and it consumes

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without pads and baluns at both input and output ports. The frequency multiplier circuits have been designed using Cadence Design Tool.

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Acknowledgments

I am thankful to my God for providing me health and energy for this thesis work and other uncountable blessings throughout my life. I would like to express my gratitude to all those who helped me in completing this thesis work. I am deeply indebted to my academic supervisor Prof. Jerzy from Electronic Devices division of Linköping University whose technical help, valuable suggestions and encouragement assisted me through out the entire thesis work and writing this report.

I am obliged to Acreo AB, Norrköping for giving me chance to use their technical resources required for this thesis work. I am deeply grateful to Dr. Darius Jakonis, my supervisor at Acreo, for his detailed and constructive comments, and for his important support throughout this work at Acreo. I warmly thank Joacim Olsson and Berthold Panznerthe for their valuable advices and friendly assistance. I wish to thank Patrick Blomqvist for his administrative help in keeping my stay at Acreo more comfortable.

I am grateful to my parents for their constant encouragement and prays on which I have relied throughout my life. I have been much supported by my wife Beenish and daughter Maham for accommodating my busy schedule in my study program.

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Preface

This master thesis work describes the design of frequency doubler circuits at 20 GHz and 40 GHz for automotive radar application. Frequency multiplier circuits facilitate building a cost-effective and stable source at higher frequency. Low-frequency, high spectral purity VCO’s are followed by frequency multiplier circuits because there are limitations to achieve low phase noise oscillator directly at high frequencies. SiGe BiCMOS technology is used for design of the frequency doubler at 20 GHz and SiGe bipolar technology for the frequency doubler at 40 GHz.

Chapter-1 starts with an introduction to automotive radar systems, their working principle and current development status. Low-cost stable signal source for automotive radars at 77 GHz can be built using VCO at low frequency followed by some frequency multiplier circuit. This architecture has a few attractions over direct implementation of VCO at higher frequency and is the motivation to this thesis work.

Chapter-2 is an introduction to frequency multipliers, their types and working principle. Theory of some basic cells used in common frequency multiplier circuits have been discussed followed by an overview of research work carried on frequency multiplier circuits.

Chapter-3 describes design of frequency doubler circuits at 20 GHz in the commercially avaialable SiGe BiCMOS technology. Schematic design of single-ended and differential circuit is provided followed by simulation results of both architectures.

Chapter-4 represents design of frequency doubler at 40 GHz in

Infineon’s B7HF200 SiGe bipolar technology (fT=200GHz). Gilbert

mixer is used for frequency doubling by feeding same signal to LO and RF ports. Schematic and layout design describing each step of balanced circuit architecture is provided.

Chapter-5 is dedicated to the performance evaluation of 40 GHz frequency doubler circuit designed in Chapter-4. Simulations are carried out using Cadence Spectra RF environment tool. Circuit’s basic parameters like conversion gain, fundamental suppression, dc power consumption and NF for both schematic and layout are evaluated and compared together.

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Chapter-6 concludes the work presented in this thesis report. The chapter also summarizes the key-points learned during the whole process followed by some recommendations for the future work.

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List of Abbreviations

Balun Balanced Unbalanced

BiCMOS Bipolar and CMOS technology on one chip

BJT Bipolar Junction Transistor

dB Decibels

dBm Power level in dB (decibels) with respect to 1 mW

DRC Design Check Rules

ETSI European Telecommunication Standards Institute

FDD Frequency Division Duplex

FCC Federal Communications Commission

FET Field Effect transistor

FM Frequency Modulation

FMCW Frequency Modulated Continuous Wave

FSK Frequency Shift Keying

CG Power / Voltage Conversion Gain

HBT Hetero Junction Bipolar Transistor

HEMT High Electron-Mobility Transistors

IF Intermediate Frequency

IIP3 Input Referred 3rd Order Intercept Point

I/O Input/Output

ITS Intelligent Transport System

LO Local Oscillator

LRR Long Range Radar

MMIC Monolithic Microwave Integrated Circuits

MOS Metal Oxide Semiconductor

PA Power Amplifier

PAC Periodic

PLL Phase Lock Loop

PNoise Periodic Noise

PSK Phase Shift Keying

PSP Periodic Scattering Parameters

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QPAC Quasi Periodic

QPSS Quasi Periodic Steady State

RF Radio Frequency

RFIC Radio Frequency Integrated Circuit

Rx Receiver

SRR Short Range Radar

SSB NF Single Side Band Noise Figure

Tx Transmitter

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Table of Contents

ABSTRACT... VII ACKNOWLEDGMENTS ...IX PREFACE...XI LIST OF ABBREVIATIONS...XIII TABLE OF CONTENTS... XV LIST OF FIGURES ... XVII LIST OF TABLES ...XIX CHAPTER-1

OVERVIEW OF AUTOMOTIVE RADAR SYSTEMS... 1

1.1. INTRODUCTION... 3

1.2. NEED FOR AUTOMOTIVE RADAR... 3

1.3. CURRENT STATUS OF AUTOMOTIVE RADARS... 5

1.3.1. Regulatory Aspects in US ... 5

1.3.2. Regulatory Aspects in Europe ... 5

1.4. FUTURE CHALLENGES... 8

1.5. SIGE: COMPETITOR TECHNOLOGY FOR AUTOMOTIVE RADAR APPLICATIONS. 9 1.6. AUTOMOTIVE RADAR TYPES AND MODULATION SCHEMES... 10

1.6.1. FM-CW... 10

1.6.2. FSK... 12

1.6.3. Pulse Doppler Radar... 13

1.7. FREQUENCY SOURCE FOR MILLIMETER-WAVE AUTOMOTIVE RADAR... 14

CHAPTER-2 FREQUENCY MULTIPLIER ARCHITECTURES ... 17

2.1. INTRODUCTION... 19

2.2. PASSIVE MULTIPLIERS... 19

2.3. ACTIVE MULTIPLIERS... 20

2.3.1. Emitter Coupled Pair as Simple BJT multiplier ... 21

2.3.2. Gilbert Multiplier Cell ... 24

2.3.3. Common Frequency Doubler Circuits ... 27

CHAPTER-3 THE DESIGN OF 20-GHZ FREQUENCY DOUBLER AND OUTPUT AMPLIFIER CIRCUIT... 29

3.1. INTRODUCTION... 31

3.2. CIRCUIT SPECIFICATIONS... 31

3.3. PROPOSED SINGLE-ENDED CIRCUIT... 32

3.3.1. Design Methodology ... 33

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3.3.3. Simulation Results ... 35

3.4. PROPOSED DIFFERENTIAL CIRCUIT... 38

3.4.1. Circuit Description... 39

3.4.2. Optimum value of size ratio K ... 41

3.4.3. Simulation Results ... 42

CHAPTER-4 THE DESIGN OF 40-GHZ FREQUENCY DOUBLER AND OUTPUT AMPLIFIER CIRCUIT... 45 4.1. INTRODUCTION... 47 4.2. TECHNOLOGY DETAILS... 47 4.3. CIRCUIT SPECIFICATIONS... 48 4.4. DESIGN CONSIDERATIONS... 48 4.5. PROPOSED ARCHITECTURE... 50 4.6. DESIGN DESCRIPTION... 50

4.6.1. Input Buffer Stage... 50

4.6.2. Gilbert Cell... 52

4.6.3. Filter... 55

4.6.4. Differential Amplifier ... 56

4.6.5. Integrated Circuit... 58

4.7. LAYOUT OF THE FREQUENCY DOUBLER CIRCUIT... 60

4.7.1. Layout Design Considerations ... 60

4.7.2. Pad Frame... 61

4.7.3. Emitter-Follower Layout... 62

4.7.4. Gilbert Cell and Filter Layout... 63

4.7.5. Frequency Doubler Core Layout... 64

4.7.6. Complete Layout ... 65

4.7.7. Layout Verification... 65

CHAPTER-5 SCHEMATIC AND LAYOUT SIMULATION RESULTS OF 40-GHZ FREQUENCY DOUBLER CIRCUIT ... 67

5.1. INTRODUCTION... 69

5.2. CONVERSION GAIN AND NF... 69

5.3. OUTPUT SPECTRUM AND FUNDAMENTAL SUPPRESSION... 71

5.4. S11 AND S22... 72

5.5. CORNER ANALYSIS... 74

CHAPTER-6 CONCLUSION AND FUTURE WORK... 77

6.1. INTRODUCTION... 79

6.2. KEY POINTS LEARNED... 79

6.3. FUTURE WORK... 80

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List of Figures

Figure 1: Installation of Automotive Radar and its different kind of

applications [9] ... 4

Figure 2: The ‘Package Solution’ [9] ... 7

Figure 3: Time schedule for the development and rollout of 79 GHz SRR sensors [9]... 7

Figure 4: Prediction of the evaluation of automotive radar application [11] ... 8

Figure 5: Typical FMCW Radar [17]... 11

Figure 6: Typical FSK Radar [17]... 12

Figure 7: Typical Pulse Radar [17] ... 13

Figure 8: RF-front end of FMCW automotive radar... 15

Figure 9: Emitter-Coupled pair [26]... 21

Figure 10 : The dc transfer characteristics of emitter-coupled pair [26]. 22 Figure 11: Two quadrant analog multiplier [26] ... 23

Figure 12: Gilbert multiplier circuit ... 25

Figure 13: Frequency doubler based on class-B configuration and output amplifier [37]... 32

Figure 14: Collector current modelled as a train of rectified cosine pulses [38] ... 33

Figure 15: Plot of Conversion Gain and NF versus input power ... 36

Figure 16: Plot of Conversion Gain and NF versus frequency ... 36

Figure 17: Output frequency spectrum for input signal of -8dBm at 20 GHz ... 37

Figure 18: Input impedance matching... 37

Figure 19: Output impedance matching ... 38

Figure 20: Frequency doubler consists of two identical unbalanced emitter-coupled pairs with emitter area ratio K and differential amplifier ... 39

Figure 21: DC transfer curves of frequency doubler [43] ... 41

Figure 22: Relative size ratio K versus gain... 41

Figure 23: Plot of Conversion Gain and NF versus input power ... 42

Figure 24: Output frequency spectrum for input power -8dBm at 20 GHz ... 43

Figure 25: Pseudo-differential output signals ... 43

Figure 26: Use of active mixer as frequency doubler ... 49

Figure 27: Proposed architecture for frequency doubler at 40 GHz ... 50

Figure 28: Emitter-follower circuit (common-collector configuration) [26] ... 51

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Figure 29: Small-signal equivalent circuit of emitter-follower circuit [26]

... 51

Figure 30 Gilbert mixer... 53

Figure 31: Variable gain of Gilbert mixer in frequency doubler circuit 54 Figure 32: Effective inductance of a lossless transmission line for l<λ/4 ... 56

Figure 33: Differential Amplifier ... 57

Figure 34: Detailed circuit diagram for frequency doubler at 40 GHz .. 59

Figure 35: Pad Frame ... 61

Figure 36: Layout of emitter-follower stage ... 62

Figure 37: Layout of Gilbert cell and filter ... 63

Figure 38: Layout of frequency doubler core... 64

Figure 39: Layout of complete chip ... 65

Figure 40: Layout verification process... 66

Figure 41: Test Bench ... 69

Figure 42: Conversion gain versus input power... 70

Figure 43: NF versus input power... 70

Figure 44: Output spectrum of the schematic ... 71

Figure 45: Output spectrum of the layout ... 72

Figure 46: S11 plotted on Smith chart... 73

Figure 47: S22 plotted on Smith chart... 73

Figure 48: Conversion gain versus frequency at different temperatures 74 Figure 49: NF versus frequency at different temperatures... 75

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List of Tables

Table-1: Specifications of LRR and SRR ... 9 Table-2: Specifications of 20 GHz frequency doubler circuit ... 31 Table-3: Design Parameters of 20 GHz frequency doubler circuit ... 35 Table-4: Summary of simulation results for20 GHz frequency doubler circuits ... 44 Table-5: Specifications of 40 GHz frequency doubler circuit ... 48 Table-6: Design parameter values for 40 GHz frequency doubler circuit

... 58 Table-7: Circuit performance at different temperatures... 76 Table-8: Comparison of frequency doubler circuits... 79

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Chapter-1

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1.1.

Introduction

Automotive radar, as the name indicates, is any radar that has an application in automobiles and other autonomous ground vehicles. As a result, it represents a large and heterogeneous class of radars that are based on different technologies (e.g., laser, ultrasonic, microwave), perform different functions (e.g., obstacle and curb detection, collision anticipation, adaptive cruise control), and employ different operating principles (e.g., pulse radar, frequency-modulated continuous-wave [FMCW] radar, microwave impulse radar) [1]. The discussion here is limited to microwave radars that form a commercially significant subset of automotive radars and is a key technology especially due to its inherent advantages like weather independence and direct acquisition of range and velocity when compared to alternative sensors like video, laser, and ultrasonic [2]. Additionally radar offers the vehicle manufacturers the stylistic advantage of mounting behind a plastic bumper.

1.2. Need for Automotive Radar

The need for automotive radars can be understood at three different levels.

National level: The statistics on traffic fatalities, injuries, and property loss due to vehicle accidents, and estimates of their fractions that are preventable with technological aids, has encouraged the development of automotive radar. The economic value of those losses, when compared with the dropping cost of automotive radar, leads to a cost-benefit analysis that favours their widespread deployment.

Automotive manufacturer level: Radar is another “feature” for the consumer to purchase that could be a possible source of revenue and competitive advantage. It is also a possible response to regulatory and public demands for safer vehicles.

Vehicle owner’s level: Automotive radar has an appeal as a safety device, and as a convenient, affordable gadget. Of greater practical importance is the potential for radar to lower the stress in

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driving and decrease the sensory workload of the driver by taking over some of the tasks requiring attentiveness, judgment, and skill. As a conclusion, automotive radar facilitates various functions that increase the driver’s safety and comfort. Some of significant functions are

• Adaptive Cruise Control (ACC) support with stop and go functionality

• Collision warning or avoidance • Blind spot surveillance

• Parking assistance (forward and reverse) • Lane change assistance

• Rear crash collision warning

Fig. 1 shows the installation of automotive radar on front bumper of vehicle and the basic applications of automotive radar.

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1.3. Current Status of Automotive Radars

Today many car manufacturers use 77 GHz radar for autonomous cruise control (ACC) and more recently for pre-crash or collision mitigation also. In 1999, ACC was first introduced to the market in the Mercedes S-Class under the name of “Distronic” [3]. In addition to 77 GHz long range ACC sensors short-range radar (SRR), operating at 24 GHz has been developed and is a key enabling technology for a number of novel driver assistance and safety systems[4].

The prediction of a possible collision requires reliable object tracking capability which means that SRR has to have sufficiently high resolution to detect smaller objects such as motor cyclists or pedestrians in vicinity of large objects [5]. Therefore, the range resolution has to be in the centimeter range, resulting in a required bandwidth of up to 5 GHz around the 24 GHz center frequency, which in fact is a so-called UWB application (Ultra Wide Band). Short-range radar emits low power signals within a typical detection range up to 30 m.

The use of the 24 GHz band has been proposed worldwide to be very suitable for SRR [6] Compatibility studies with other services in this frequency band - Fixed Services, Radio Astronomy Services and Earth Exploration Satellites Services –were carried out successfully.

1.3.1. Regulatory Aspects in US

In summer 2002 the FCC adopted the 24 GHz radar sensor approach for the operation of vehicular radar in the 22-29 GHz band using directional antennas on terrestrial transportation vehicles. The center frequency of the emission and the frequency at which the highest radiated emission occurs are higher than 24.075 GHz. A corresponding approach would be favourable also for Region 3 countries [6].

1.3.2. Regulatory Aspects in Europe

The SRR concept has been strongly supported by the European Commission within its e-Safety initiative. In order to allow an early

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introduction of the SRR approach in Europe and to meet some of the requirements of the e-Safety initiative a temporary solution was developed accordingly. The implementation of SRR in Europe is based on the following frequency management considerations, adapted in a decision of the European Commission on January 17, 2005:

• Possible temporary use of 21.65-26.65 GHz (24 GHz) frequency band with limited number of equipment in the market place and only applicable for a limited time frame; from 07/2005 to 06/2013. Technical conditions on SRR implementation should be established in order to ensure protection of the existing services in the 24 GHz band, thus, the SSR system penetration rate is restricted to 7 percent of all cars in each country of the European Community.

• A permanent frequency band at 77-81 GHz range for short-range radar applications in Europe was established in parallel. This 79 GHz band has been made available reliably within EU member states and other CEPT countries in order to encourage industry development of components and technology for this frequency band.

According the output of the compatibility study [7] the introduction of Short Range Radars in Europe should be in accordance with the 2-phase plan shown in Fig. 2, the so-called ‘package solution’. To accomplish the long-term requirement, a new frequency band with 4 GHz bandwidth for automotive short range radars was designated around 79 GHz, in the band 77 to 81 GHz. This band was designated to be a stable and permanent frequency band for SRR employment only [8]. Such a reliable designation is important for the automotive components industry to provide the substantial investments necessary for the deployment of the 79 GHz equipment [9].

The most important obstacle today is that the necessary components for SRR, using the 77 or 79 GHz band, are not yet commercially available. The development will take at least 5-6 years. Thus, the automotive industry has fostered this two-fold approach using 24 GHz with a fixed deadline of 8 years to later migrate to a long-term frequency band. This will limit the number of vehicles on the road and thus prevent any aggregate interference potential, while allowing time for the development of the necessary components for exploitation of the technology at the

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higher frequency and for an early contribution to the enhancement of road safety.

Figure 2: The ‘Package Solution’ [9]

Already in the year 2009, a report has to be made about the development status of 79 GHz SRR technology [10]. The ECC frequency regulation forces the development of 79 GHz SRR sensors within a time frame of only 8.5 years. Considering the development cycles of automobiles this is a very short time period. The transition from 24 GHz to 79 GHz causes an increase in frequency and a reduction of wavelength by the factor 3.3. 7KHVPDOOHUZDYHOHQJWKHQDEOHVUHGXFHG DQWHQQDVL]HDQGVSDFLQJ a 

and lower effective antenna DUHD a2). The higher frequency yields

increased atmospheric and bumper losses. With higher frequencies semiconductor power output decreases (roughly 20 dB per decade), parasitic effects are more stringent, and packaging and testing are more difficult. The development plan towards the introduction of 79 GHz SRR sensors is shown in Fig. 3.

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1.4. Future Challenges

Some of the most important challenges for the future in the development of automotive radar include

• Development of automotive radars at permanent allocated band (77-81 GHz) with multiple functions like long-range, short-range and precision ranging.

• Combined radar for ACC, pre-cash sensing and parking support • Implementation of 77-81 GHz automotive radar at low cost to

make it affordable for most of customers. The use of vehicle radar will become more widespread as prices drop and the technology proves its worth. As that happens, various technologies will compete to serve as vehicles' "eyes." and technology with low cost will have dominant edge over others.

• Development of more advanced human interface and meeting user expectations which are increasing with time as predicted in Fig. 4 and they will keep their stress in evaluation of technology that will eventually capable of providing a complete driving support with automated throttle, break and steering controls of vehicle.

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1.5. SiGe: competitor technology for automotive radar

applications

The historical path in the electronics industry for reducing cost, and improving and increasing functionality, has been to migrate toward IC-based solutions. Therefore, in the first phase an effective and powerful chip technology has to be developed. With the funding of the German Ministry of Education and Research (BMBF) the joint research project “Automotive high frequency electronics – KOKON” [12] was started in September 2004. The KOKON consortium consists of two semiconductor companies (Atmel and Infineon), two automotive radar sensor manufacturers (Bosch and Continental Temic), and one automobile company (DaimlerChrysler) supported by institutes and universities. Silicon Germanium (SiGe) has been identified as the chip technology which may fulfil the technological requirements and the cost constraints and which might be an alternative to GaAs [13]. Within the KOKON project the development of both 77 GHz LRR and 79 GHz SRR radar chip technology is investigated. As spin-off cost reduction and performance improvement of 77 GHz LRR (long-range radar) sensors are expected. The specifications of the 76.5 GHz LRR and 79 GHz SRR systems are listed in Table-1.

Table-1: Specifications of LRR and SRR

Parameter LRR SRR

No of sensors Single-sensor Multiple-sensors

Frequency 76.5 GHZ 79 GHz

Bandwidth 200 MHz 4000 MHz

Maximum field of view 6.5°-10° 160°

Range 200m 30 m

Range Accuracy 0.75 m 5 cm

Angular Resolution 3° 5°

Bearing Accuracy ±0.1°-0.4° 1°

With the allowed bandwidth B of 4 GHz in 79 GHZ SRR, the achievable UDQJHUHVROXWLRQû5LV3.75 cm according to the range resolution equation B c R 2 = ∆ (1)

In Equation (1) the factor ½ is due to the two-way travel time and c is the speed of light.

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With Silicon Germanium heterobipolar transistors (SiGe HBT) nowadays

transit frequencies fT of 300 GHz and fmax of 350 GHz have been

reported by an IBM research group [14]. Infineon which is partner of the

KOKON consortium has achieved up to now fT of 225 GHz and fmax of

300 GHz [15]. Therefore, even very high frequency applications like wireless LANs at 60 GHz and 79 GHz radar MMICs, which can now only be realized in expensive 111-V technologies, seem to become feasible in a low cost silicon based technology in a highly integrated manner.

One severe drawback of progress in SiGe technology is the avalanche

breakdown voltages (BVCEO BVCBO) which are further and further

reduced [16]. These technologies are not suitable for ICs with high output power, where the transistor output voltage must substantially exceed the supply. Still, for automotive radars application, SiGe HBT technology has the potential to realize cost effective “radar on chip” solutions.

1.6. Automotive Radar Types and Modulation Schemes

Most forward-looking automotive radar systems are being developed at 77 GHz frequency using FM-CW, Frequency Shift Keying (FSK), or Pulse Doppler modulation [17]. The operation principle of these types is briefly described below.

1.6.1. FM-CW

The operation of the FMCW can be explained using the block diagram in

Fig. 5. The radar transmits a CW signal whose frequency is modulated as a function of time with a triangular waveform. For typical FM-CW radars the frequency deviation is on the order of 150 to 300 MHz with a period of approximately 1 millisecond. The typical automotive radar will transmit three to five beams (approximately 3" beamwidth), or use beam scanning, to illuminate the center lane and the traffic lanes to both the left and to the right of the automobile. Some radars will transmit a single wide beam (approximately 12" beamwidth) and use the monopulse receive techniques to locate vehicles off of boresight on the left and right of the automobile. The signal reflected by the target (radar echo) in the

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signal and the radar echo are demodulated in a mixer. If the target is moving relative to the radar transmitter, the demodulated I.F. frequency is as shown in figure. If the target is stationary (no Doppler) the I.F. frequency is constant and proportional to the range to the target. The I.F. output is sampled by an A/D converter and a Fourier Transform is applied. The average frequency (df) determines the range to the target, and the Doppler frequency contains the relative velocity information. This information is processed by the on board microprocessor used to control the ACC radar function.

Figure 5: Typical FMCW Radar [17]

A/D FFT FM Mod 76 GHz VCO LO Duplexer Antennas Mixer IF Output time time Transmitted

wave Target Echo

RF Freq F1 F2 TD df Td

2 ( 2

1)

c df

Td

R ange

F

F

×

×

=

×

IF Freq df-fDop df+fDop A/D FFT FM Mod 76 GHz VCO LO Duplexer Antennas Mixer IF Output time time Transmitted

wave Target Echo

RF Freq F1 F2 TD df Td

2 ( 2

1)

c df

Td

R ange

F

F

×

×

=

×

IF Freq df-fDop df+fDop

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1.6.2. FSK

A second type of ACC radar utilizes a FSK mode of operation. This type of radar is a variant of the FM-CW radar. The radar transmits a CW signal whose frequency is changed by typically 150 to 500 KHz every microsecond as shown in Fig. 6. The I.F. output is processed in a similar manner to the FM-CW radar. The phase difference between the transmit and receive signals will contain the range information, and the Doppler information is contained in the I.F. Frequency. Due to the type of processing performed, FSK radars usually only respond to Doppler-shifted return signals (i.e. signals from targets moving relative to the radar).

Figure 6: Typical FSK Radar [17]

Transmitter LO Duplexer Antenna Mixer Range or time Frequency time Signal at mixer Transmitted signal Radar return f1 f2 Magnitude û-Frequency f1

Frequency f2 Phase difference gives range1 degree = 1.5 meters

Two radar signals with a difference frequency û& will have different phase delay depending upon the range to the target. The phase difference û& = û-XR.nge/C

Transmitter LO Duplexer Antenna Mixer Range or time Frequency time Signal at mixer Transmitted signal Radar return f1 f2 Magnitude û-Frequency f1

Frequency f2 Phase difference gives range1 degree = 1.5 meters

Two radar signals with a difference frequency û& will have different phase delay depending upon the range to the target. The phase difference û& = û-XR.nge/C

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1.6.3. Pulse Doppler Radar

The third type of radar used in the ACC application is the classic pulse Doppler radar shown in Fig. 7. A simplified version of the block diagram for five-beam radar is shown. The radar signal source alternates between two frequencies separated by 200 MHz (the I.F. frequency). At time t = 0 the radar is at frequency F1. At time t = z, the transmit frequency changes to F2 where it remains for a time period that is much greater than the twice the propagation time to the furthest potential target. The delayed echo from the target is demodulated in the mixer. The time delay between the transmitted pulse and the pulse echo determines the range to the target. The velocity can be determined from the rate of change of the target position or by using coherent pulse Doppler techniques.

Figure 7: Typical Pulse Radar [17] 76.5, 76.7 GHz Mixer IF Output Antennas Phase Lock Circuits time F2-F1 time F2 F2 Td Delayed Echo time F1 F1 F2-F1 76.5, 76.7 GHz Mixer IF Output Antennas Phase Lock Circuits 76.5, 76.7 GHz Mixer IF Output Antennas Antennas Phase Lock Circuits time F2-F1 time F2 F2 Td Delayed Echo time F1 F1 F2-F1

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1.7. Frequency Source for Millimeter-wave Automotive

Radar

For automotive radar sensor applications in a FMCW system, a low cost wide-band voltage controlled oscillators (VCO) with a moderate tuning range and low phase noise are needed. Typically a tuning range of l GHz from 76-77 GHz with a phase noise of -80 dBc/Hz at the 100 kHz offset is required for a VCO used [18].

For a stable millimeter-wave signal source, the signal generation can be realized either directly by a voltage-controlled oscillator (VCO) or by multiplication from a lower frequency. For 77 GHz automotive radar systems, signals in the 77 GHz band must be stabilized with low phase noise. The first approach has poor phase noise, so a phase locked loop (PLL) is required. However, by using a PLL, usually the whole system becomes too complex. Nevertheless, Infineon has recently demonstrated encouraging results, by producing fully integrated SiGe VCOs with powerful output buffer for 77 GHz automotive radar system [16]. This VCO has the following features:

• Chip size: 0.8 x 1.2 mm2,

• Center frequency: 77 GHz, • Tuning range: 6.7 GHz,

• Phase noise: -97dBc/Hz at 1 MHz offset frequency, • Output power (2 outputs): 18.5 dBm

• Single power supply: -5.5 V • Power consumption: 1.2 W

However, for achieving maximum output power, the output transistors have been driven near to their practical limits, given by high-current effects and avalanche breakdown. This design was possible with deployment of adequate transistor models, which were capable of detecting potential worsening of circuit performance by avalanche breakdown.

The second approach, which is based on frequency multiplication, increases the flexibility of the system design by using a low phase noise technology in realizing oscillators of high spectral purity at lower frequencies [19]. Frequency multipliers have been used in the past as well and still they have attraction in building cost-effective and stable

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sources at higher frequencies as long as technology allows comparable or better results using direct realization of oscillators at higher frequencies. Unfortunately, the phase noise performance is degraded during frequency multiplication at the rate of 20 log(N) where N is the multiplication factor. A doubler will degrade the phase noise by 6 dB, a tripler about 10 dB and 10-times multiplication will degrade phase noise by 20 dB equating to about 6 dB per octave.

This thesis work is focused on design of frequency doubler circuits in SiGe technology at 20 GHz and 40 GHz frequencies targeting automotive radar application.

Figure 8: RF-front end of FMCW automotive radar

For a FM-CW modulation, a typical RF front-end of automotive radar is shown in Fig. 8. In the block diagram, VCO at 40 GHz followed by a frequency doubler is used to achieve the frequency source of 80 GHz.

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The frequency doubler and the following buffer are marked in the block diagram to emphasize scope of the presented thesis work

In fact, other frequency multiplier circuits e.g; frequency tripler or frequency quadrupler can also be used with corresponding low frequency oscillators. However, the use of frequency multiplier circuits with even higher multiplication factors is rare due to their low conversion gain and poor efficiency.

The following chapter includes discussion on basics of frequency multipliers and their common architectures.

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Chapter-2

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2.1. Introduction

Nonlinear operations on continuous-valued analog signals are often required in instrumentation, communication, and control-system design. These operations include rectification, modulation, demodulation, frequency translation, multiplication and division. RF frequency multipliers are nonlinear devices that produce an output signal with a frequency that is larger than the frequency of a corresponding input signal by a predetermined factor. RF frequency multipliers operate over a specific input frequency range and are able to suppress or reduce unwanted harmonics from the output signal. There are two basic types of devices: active and passive. Passive RF multipliers produce an output signal with a power level that is smaller than that of the input signal. The difference in power levels between the output signal and the input signal is called conversion loss, an amount that is expressed in decibels. Conversion loss is a negative number, but usually specified as an absolute value. Active RF multipliers may produce an output signal with a power level that is larger than that of the input signal. The power level difference between the output signal and the input signal is called conversion gain, an amount that is measured in decibels (dB) and expressed as a positive number.

Performance specifications for RF frequency multipliers include multiplying factor, input power, output power and spurious rejection. Frequency doublers, triplers, quadruplers and quintuplers are commonly available. The input power is the amount of RF power that must be applied to a device in order to multiply the frequency of the input signal. It is also the specified power range for the conversion loss. Both output power and input power are expressed in decibels relative to one milliwatt (dBm). Spurious rejection is the difference between the desired output harmonic and any other harmonic which can be seen at the RF multiplier’s output. It is usually expressed as a positive ratio in decibels relative to the carrier power (dBc).

2.2. Passive multipliers

Passive multipliers are popular for the simplicity of their structure (usually a diode), for the reliability of the nonlinear frequency-multiplying element, and for the very high maximum frequency of

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operations. Quite naturally, the frequency multiplication cannot yield any conversion gain, but only losses; which is partly compensated by the low or zero DC power consumption. The cascading of an amplification stage can balance the power budget, but requires two circuits for the complete treatment of the signal. Both the circuits are reasonably well established now, and a reliable design can be performed. However, compared to an active implementation, it adds complication to the circuitry.

Passive multipliers can be classified as resistive or capacitive (or reactive, in general) types [20]. In the first case, the frequency-multiplying mechanism is the strong nonlinearity of the conduction current in the diode. In the second case, the frequency-multiplying mechanism is the nonlinear nature of the reactance of the diode, typically the junction capacitance. In this latter case, the depletion capacitance in reverse bias is used as nonlinear reactance in order to avoid the conduction current present when the diffusion capacitance is not negligible. However, especially at high frequency, both mechanisms are found to contribute to frequency multiplication [21]. A semiconductor junction device which has a nonlinear capacitance is known as a varactor.

Such varactor-based frequency multiplier circuits are widely used in

parametric amplification, mixing, detection, and voltage variable tuning. A great variety of diode structures have been developed, especially for very high frequencies, that can reach the THz range [22–23]. Many structures have a back-to-back arrangement and a symmetric C-V characteristic that allow zero-bias operations and efficient frequency tripling. Resistive multipliers, in principle, have infinite bandwidth, given the nonfrequency- dependent nature of resistive nonlinearities. However, the associated junction reactance and the reactive parasitic elements of the diode imply a frequency-dependent behaviour of the element. Moreover, matching networks will further limit the bandwidth.

2.3. Active multipliers

Active frequency multipliers are attracting a lot of attention as an alternative to gain more signal power at a desired frequency and as a way to implement frequency multipliers in integrated circuits. Frequency multiplication is usually performed by generation of upper harmonics of a fundamental frequency input signal. This is obtained by excitation of strong nonlinearities within the semiconductor device. Classical active frequency multipliers exploit the square-law characteristics of a FET or

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the exponential IC-versus-VBE law of a bipolar by driving it into compression and generating vast number of harmonics. In terms of design issues for active frequency multipliers, the choice of the bias point is critical for the efficiency and performance of the devices. While the input is matched to the fundamental frequency, the output is matched to the desired harmonic (e.g. 2nd harmonic for a doubler) with a short circuit for the fundamental frequency (e.g. an open /2-stub). [24, 25]. A simple emitter coupled pair of bipolar transistors can also act as frequency multiplier.

2.3.1. Emitter Coupled Pair as Simple BJT multiplier

Emitter coupled pair as shown in Fig. 9 can be used as a simple multiplier.

Figure 9: Emitter-Coupled pair [26]

The output currents IC1 and IC2 depend on the input differential voltage Vid and their following relation can be proven [26]:

) V V ( I I T id EE C − + = exp 1 1 (2)

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) V V ( I I T id EE C exp 1 2 + = (3)

where VT is the thermal voltage and IEE is tail current, while the base

currents have been neglected.

Equations (2) and (3) can be combined to give the difference current. ) 2 tanh( 2 1 T id EE C C C V V I I I I = − = × ∆ (4)

The above relationship shows that the emitter-coupled pair by itself can be used as a simple multiplier (Fig. 10 ).

Figure 10 : The dc transfer characteristics of emitter-coupled pair [26]

With the assumption that the differential input voltage Vid is much less

than VT we can utilize the following approximation

T id T id V V V V 2 ) 2 tanh( ≈ 1 2 T << id V V (5) and equation (4) becomes

) 2 ( T id EE C V V I I ≈ × ∆ (6)

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The current IEE is the bias current of emitter-coupled pair. With the

addition of more circuitry, we can make IEE proportional to second input

voltage Vi2 as shown in Fig. 11.

Figure 11: Two quadrant analog multiplier [26]

Thus, we have ) ( i2 BE(on) o EE K V V I = − (7) Putting equation (7) in (6) ) 2 ( ) ( 2 ( ) T id on BE i o C V V V V K I ≈ − × ∆ (8)

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Under the assumption Vid is small and Vi2 is greater than VBE(on) we have come up to a relation that shows the multiplier function. The latter restriction means that the multiplier functions in two quadrants of the Vid-Vi2 plane and this type of circuit is known as two-quadrant multiplier. The restriction to two quadrants of operation is a severe one for many communications applications, and most practical multipliers allow four-quadrant operation. The Gilbert multiplier cell is a modification of the emitter-coupled cell, which allows four-quadrant multiplication. It is the basis for most integrated-circuit balanced multiplier systems. The series connection of an emitter-coupled pair with two cross-coupled, emitter coupled pairs produces a useful transfer function as shown in the next section.

2.3.2. Gilbert Multiplier Cell

For the Gilbert cell shown in Fig. 12, we assume that all transistors are identical and output resistances of transistors and that of biasing current source can be neglected. The collector currents using equation (2) and (3) are as follows ) V V ( I I T C C 1 1 3 exp 1+ − = (9) ) V V ( I I T C C 1 1 4 exp 1+ = (10)

Similarly for Q5 and Q6

) V V ( I I T C C 1 2 5 exp 1+ = (11) ) V V ( I I T C C 1 2 6 exp 1+ − = (12)

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Figure 12: Gilbert multiplier circuit Similarly, IC1 and IC2 are related to V2

) V V ( I I T EE C 2 1 exp 1+ − = (13) ) V V ( I I T EE C 2 2 exp 1+ = (14)

Putting values of IC1 and IC2 into equations (9)-(12)

] exp 1 ][ exp 1 [ 1 2 3 ) V V ( ) V V ( I I T T EE C − + − + = (15)

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] exp 1 ][ exp 1 [ 2 1 4 ) V V ( ) V V ( I I T T EE C + − + = (16) ] exp 1 ][ exp 1 [ 1 2 5 ) V V ( ) V V ( I I T T EE C + + = (17) ] exp 1 ][ exp 1 [ 2 1 6 ) V V ( ) V V ( I I T T EE C − + + = (18)

The differential output current is then given by

) ( 4 6 5 3 6 4 5 3 C C C C C C I I I I I I I = − = + − + ∆ − − ) ( ) (IC3 IC6 IC4 IC5 I = − − − ∆ (19) ) 2 tanh( ) 2 tanh( 1 2 T T EE V V V V I I = × ∆ (20)

The dc transfer characteristics, then, is the product of the hyperbolic tangent of the two input voltages. There are three main applications of the Gilbert cell depending of the V1 and V2 range compared to VT.

• If V1<VT and V2 < VT, the hyperbolic tangent function can be approximated as linear and the circuit behaves as a multiplier developing the product of V1 and V2.

• If one of the inputs of a signal that is large compared to VT. This

effectively multiplies the applied small signal by a square wave, and acts as a modulator.

• If both inputs are large compared to VT, and all six transistors in the circuit behave as non-saturating switches. This is useful for the detection of phase differences between two amplitude-limited signals, as it is required in phase-locked loops, and is sometimes called the phase-detector mode.

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Thus, for small-amplitude signals, the circuit performs an analog multiplication. Unfortunately, the amplitudes of the input signals are

often much larger than VT. An alternate approach is to introduce a

nonlinearity that predicts the input signals to compensate for the hyperbolic tangent transfer characteristic of the basic cell. The required nonlinearity is an inverse hyperbolic tangent characteristic [26]. This technique is used in so-called four-quadrant analog multipliers.

2.3.3. Common Frequency Doubler Circuits

After describing some basics of active frequency multipliers, the following discussion will be focused on frequency doubler circuits (multiplication factor =2 for frequency multiplier). It is important to discuss research work, which has been carried out on frequency doublers by now.

Bipolar frequency doublers often use a push-pull design, where both outputs of a balanced input buffer are connected together to drive a single common emitter HBT operated in class-B mode, where the output match again is optimized for the 2nd harmonic [27]. These designs provide a single ended output and good efficiency.

The research presented in [28]–[32] all takes the same approach of using the nonlinearities of a transistor biased to operate in a class-B configuration. This generates an output current rich in harmonic content. The research in [31] is an unbalanced design that uses only a matching network at the second harmonic and has an output power of 3 dBm and a low fundamental suppression of 11 dB. In [28]–[30], the fundamental suppression is improved despite the unbalanced design with the use of an output resonant stub. A class-E unbalanced doubler was also presented in [33] with high conversion efficiency, but it was not a monolithic- microwave integrated-circuit (MMIC) or RF integrated-circuit (RFIC) design.

In a balanced design, a higher output power can be obtained because of the additional swing that differential operation allows. However, differential operation requires a 3-dB increase in the input drive level and the dc power. The balanced topology also has the advantage of achieving broad-band fundamental suppression without the use of a resonator structure at the output [34] and it is easily integrated with a differential oscillator. An example of balanced operation is [35], where linear

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multiplication is used to achieve doubling by connecting the local oscillator (LO) and RF ports of a Gilbert cell together. The research in [32] is also a balanced design, but operates in a class-B configuration and good fundamental suppression is achieved due to the balanced topology. The performance of a doubler can be further improved by using a second harmonic reflector at the input of the transistors. This increases the conversion gain at the expense of a decrease in bandwidth and increase in circuit area. For this reason, input reflectors are seldom used in monolithic designs. However, with accurate electromagnetic design to account for parasitic coupling paths, miniaturized input reflectors can be used to improve the performance of a monolithic doubler without a significant increase in area.

Depending on the topology used, there are tradeoffs between area, bandwidth, efficiency, and output power. Although the active doublers referenced above all achieve conversion gain, their power-added efficiencies (PAEs) are generally quite low. Frequency doublers have been implemented using field-effect transistor (FET) devices such as GaAs high electron-mobility transistors (HEMTs) [28], pseudomorphic high electron-mobility transistors (pHEMTs) [29], InP HEMTs [30] or silicon-on-insulator (SOI) CMOS [31], while some designs are realized using HBT devices like InGaP [32] or SiGe [35]. SiGe HBT devices are more nonlinear than HEMT devices and result in excellent conversion gain and low-cost designs.

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Chapter-3

The Design of 20-GHz Frequency Doubler

and Output Amplifier Circuit

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3.1.

Introduction

The frequency doubler circuits at 20 GHz have been designed using SiGe BiCMOS process that allows CMOS logic to be highly integrated with ultra high performance hetero-junction bipolar transistors (HBJT) on silicon germanium base making it optimal for mixed-signal and RF circuits. Hetero-junction bipolar transistors have significantly higher forward gain and lower reverse gain which translates into better high

frequency performance than typically available from homo-junction or

traditional bipolar transistors. With a hetero-junction technology, the opportunity for band gap tuning exists which has normally been available only to compound semiconductors. SiGe processes achieve costs that are similar to silicon CMOS manufacturing versus other more expensive hetero-junction technologies such as GaAs.

3.2. Circuit Specifications

Specifications for the frequency doubler and amplifier circuit at 20 GHz are given in Table-2. Parameters that have priority are conversion gain, fundamental suppression and NF. Input and output impedances should PDWFKWR 

Table-2: Specifications of 20 GHz frequency doubler circuit

Parameter Min Typ Max Unit

Supply voltage 1.8 V

Power supply current 50 mA

Conversion gain 5 dB Fundamental suppression 20 dBc Noise figure 8 dB IIP3 6 dBm RF input power -8 -5 -2 dBm RF input frequency 19.25 20.25 GHz RF output power -3 0 3 dBm RF output frequency 38.5 40.5 GHz

Input and output impedances 50 Ÿ

S11, S22 -15 dB

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3.3. Proposed Single-ended Circuit

The 1.8 V supply voltage was one of the driving factor to select an appropriate architecture for frequency doubler. For example, Gilbert multiplier cell cannot be implemented here due to low supply voltage as it is not possible to stack more than two transistors. The proposed circuit has the classical approach of using the nonlinearities of a transistor pair biased to operate in a class-B configuration. As already discussed, biasing of transistors in such a case is very critical. The circuit shown in Fig. 13 is driven by a differential signal and produces single-ended output. A common-emitter amplifier is used at output stage, which will drive the load. Input and output impedance matching networks are also shown. Both CMOS and bipolar transistors have been used to take advantage of SiGe BiCMOS process.

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3.3.1. Design Methodology

Q1 and Q2 operating closed to class-B configuration are serving as the doubling stage while Q3 is used to build common-emitter circuit required

for amplification of the 2nd harmonic signal generated in previous stage.

The use of a cascode amplifier as the output stage could have helped in reducing the Miller effect along with amplification of the signal from the doubling stage [37]. But the low supply voltage limits the number of transistors to be stacked precluding thereby a cascode amplifier from this design.

M1, M2 and M3 are CMOS transistors used as active loads and they are controlling base currents of Q1, Q2 and Q3 respectively. M4, M5 and M6, M7 build current mirror circuits required for controlling currents ICM1 and ICM2 in doubling and amplification stages respectively. For dc biasing and dc current control, CMOS transistors are used due to their superior behavior over bipolar transistors in terms of power consumption.

The doubling stage is biased close to class-B (VBE = 0.8 V). The size of

the transistors can be determined by considering the relationship between the output power and dc power consumption. The harmonic component of collector current is a function of conduction angle, which can be controlled by the input driving power and the base bias point [37].

Figure 14: Collector current modelled as a train of rectified cosine pulses [38]

The collector current can be modelled as a train of rectified cosine pulses as shown in Fig. 14 and using the Fourier series expansion, it can be represented as [34]

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1 1 2 2

( ) ( ) ( ) ....

c o

I t =I +I cos w t +I cos w t + (21)

where In is the nth harmonic current component ()

4o o max t I I T π = (22) 0, n I = for odd n 2 cos 8 2 1 o o n max o n t t T I I T nt T π π          =   −         , for even n (23)

and Imax is the maximum current, tois the length of the pulse, T and is the

period corresponding to the fundamental frequency. To maximize the amplitude of the second harmonic, the conduction duty cycle for each transistor was chosen to be to/T = 0.32.

All bipolar transistors were initially sized for optimum collector current density and their optimum size was used throughout the design with Cadence tools.

3.3.2. Improvement by Second Harmonic Reflector

The performance of a doubler is further improved by using a second harmonic reflector at the input of the transistors. This increases the conversion gain at the expense of a reduced bandwidth and larger circuit area [38]. For this reason, the input reflectors are seldom used in monolithic designs. However, when the parasitic coupling paths are carefully account for, miniaturized input reflectors can be used to improve the performance of a monolithic doubler without a significant increase in area. Parasitic feedback at the second harmonic is important to the doubler performance because the position of the reflector determines the phase of the reflected signal, which interferes either constructively or destructively with the desired output signal [39].

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For the current design, passive elements Lr and Cr have been used to act

as a second harmonic reflector. Simulation shows an improvement of about 3dBm in conversion gain when second harmonic reflector circuit is

optimized over Lr keeping Cr constant. Impedance matching at the input

and output ports is also carried out using passive elements. The design values of all passive elements are given in Table-3.

Table-3: Design Parameters of 20 GHz frequency doubler circuit

Parameter Value Unit

Lp1 476 pH Ls1 125 pH Cs1 400 pF Cs2 400 pF Cs3 400 pF Ls3 42 pH Lchoke 100 pH Lr 46 pH Cr 125 fF

Physical sizes and shapes of inductors have been investigated using a built-in inductor modelling tool available with the process design kit. The MIM capacitors provided are between consecutive metal layers.

3.3.3. Simulation Results

For conversion gain (S21) and NF measurement, a combination of PSS (periodic steady-state) and PSP (periodic scattering parameters) analysis was used. Fig. 15 shows that the conversion gain varies with the input power and its maximum value is around 14 dB for -9 dBm at the input. Practically, the optimum operating input power would be between -10 dBm to -8 dBm. This operating range also ensures minimum NF, which is around 12 dB.

PSS and PSP analysis were also used to estimate the conversion gain and NF at fixed input power = -8 dBm over the whole input frequency band (19.25 GHz – 20.25 GHz). The result shown in Fig. 16 indicates that NF remains almost constant throughout the band while conversion gain at the maximum frequency degrades by 1 dB as compared to the gain at minimum frequency.

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The output frequency spectrum is plotted in Fig. 17 by taking DFT of the signal. The fundamental suppression is around 32 dBc (the vertical scale of the plot is logarithmic. Another strong harmonic is the 4th harmonic at 80 GHz which is separated by 16 dBc.

S21 and NF Versus Input Power Input Frequency = 20 GHz 0 3 6 9 12 15 18 -15 -12 -9 -6 -3 0 Input Power (dB) S21 (dB) NF (dB)

Figure 15: Plot of Conversion Gain and NF versus input power

66DDQGQG11))99HHUUVVXXVV,,QQSSXXWW))UUHTHTXXHHQQFF\\ ,,QQSSXXWW33RRZZHHUU  G%G%PP 6.00 9.00 12.00 15.00 18.00 19.00 19.30 19.60 19.90 20.20 20.50 Frequency (GHz) S21 (dB) NF (dB)

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Figure 17: Output frequency spectrum for input signal of -8dBm at 20 GHz S11 and S22 are plotted in Fig.18 and 19, respectively.

Input Impedance Matching Input Power = -8 dBm -50.00 -45.00 -40.00 -35.00 -30.00 -25.00 -20.00 19.00 19.30 19.60 19.90 20.20 20.50 Frequency (GHz) S 1 1 (d B )

Figure 18: Input impedance matching

Output Frequency Spectrum Input = 20 GHz @ -8 dBm 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 0 20 40 60 80 100 Frequency (GHz) DFT

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Output Impedance Matching Input Power = -8 dBm -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 38.00 38.60 39.20 39.80 40.40 41.00 Frequency (GHz) S 22 (d B )

Figure 19: Output impedance matching

To summarize, the circuit consumes 54 mA average DC current at 1.8 V supply voltage, it has 14 dB conversion gain at -9 dBm input and keeps the fundamental tone 32 dBc apart from the desired harmonic.

3.4. Proposed Differential Circuit

The differential frequency doubler circuit as shown in Fig. 20 utilizes an emitter-coupled pair as its basic cell. This doubler circuit was first introduced by Ogawa and Kusakabe in 1978 [40]. This circuit consists of two identical unbalanced emitter-coupled pairs with emitter area ratio K. A differential amplifier formed by Q5 and Q6 is used at the output stage to amplify the 2nd harmonic tone.

One of emitter-coupled pairs is formed by Q1 and Q4 having unity size while Q2 and Q3 have larger size with relative ratio K and act as second emitter-coupled pair. M1 and M2 are active CMOS loads for biasing the bipolar transistors. There are three current control circuits placed at the bottom of the circuit to control current in two-emitter coupled pairs and the differential amplifier. For simplicity, impedance matching networks used at the input and output ports are not shown in the schematic.

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Figure 20: Frequency doubler consists of two identical unbalanced emitter-coupled pairs with emitter area ratio K and differential amplifier

3.4.1. Circuit Description

Assuming bipolar devices are matched and that the base-width modulation is ignored, the differential output current of the frequency doubler can be expressed as [42, 43].

tanh tanh 2 2 in K in K FD F O T T V V V V I I V V α   +   −  ∆ =        (24) 2 sinh cosh cosh K F o T FD K T T V I V I V V in V V α    ∆ =     +         (25) 1 2 1 2 cosh F o FD T I K K I V in K V K α  −    ∆ =   + +     (26)

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where

• VT is thermal voltage equal to kT/q, k is Boltzmann's constant, T

is absolute temperature in degrees Kelvin, q is charge of an electron,

• aF is dc common-base current gain factor

• Vk is offset voltage deriving from the unbalanced constitution and

defined as VK = VT ln ( K ) .

• Vin is the differential input voltage

Using 1 ...(| | |1) 1 1 << − = +X X X , expanding (26) 1 cosh( ) 2 1 ... 1 1 1 2 in T FD F o V K V K I I K K K K α          ∆ = ++          (27) Using 2 4 2 cosh( ) 1 ...( ) 2 12 x x x = + + + x < ∞

(

)

(

)

2 2 2 2 2 4 2 1 2 2 1 1 ... ... 1 2 12 1 in in FD F o T T K K V V I I K V V K α −     ∆ = + + + + +     (28)

(

)

(

)

(

)

2 2 4 2 2 2 4 2 1 2 1 ... 6 1 in in FD F o T T K V V I I K K K V V K α −   ∆ = − − −   + (29)

The differential output current is expressed as a function of the square of the differential input voltage. Fig. 21 shows dc transfer curves of the frequency doubler, calculated using (24) with various values of parameter K. For a small input voltage the transfer curve is approximately a parabola. Therefore, the input frequency is doubled by this circuit.

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Figure 21: DC transfer curves of frequency doubler [43]

3.4.2. Optimum value of size ratio K

Size of Q1 and Q4 was selected as 1 µm. The optimum value of size ratio K was found by simulations. The value selected for K is 6 as shown in Fig. 22 and the doubler conversion gain is maximum at that point. This

determines the size of Q2 and Q3 as 6 µm.

Size ratio versus gain

Frequency = 20 GHz, Pin = -10dBm 2 4 6 8 10 12 0 2 4 6 8 10

K (relative size ratio)

S

21

(d

B

)

References

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