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MANUAL: Flywheel electronics

Fredrik Evestedt

April 25, 2015

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Contents

1 Introduction 2

2 System overview 2

3 Standards 4

3.1 DSUB pinout . . . . 4

3.2 Design guidelines for cRIO interface boards . . . . 5

3.3 Digital Input protection . . . . 5

4 Interface PCBs 6 4.1 Digital OUT Interface (NI9401) . . . . 6

4.2 Digital IN Interface (NI9401) . . . . 7

4.3 Analog IN (NI9201) . . . . 8

4.4 Analog IN (NI9205) . . . . 9

5 The power electronics 10 5.1 IGBT . . . . 10

5.2 IGBT PCB . . . . 11

5.3 Drivers . . . . 11

5.4 Driver PCB . . . . 12

6 Measurement systems 13 6.1 Voltage . . . . 13

6.2 Current . . . . 14

7 DC power source 15 8 Useful Links 16 8.1 Bill of Materials (Requires access to the shared folder) . . . . 16

8.2 Datasheets . . . . 16

8.3 Application notes . . . . 17

8.4 Eagle PCB files . . . . 17

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1 Introduction

A flywheel is used for storing energy in a rotating mass, the amount of energy stored is described by the following equation.

E = J ω

2

2

This system is designed for low weight and high rotational speed. In the figure below a sketch of the current flywheel design is shown. The power electronics described in this document is the system used for controlling the flywheel’s electric machine.

More information about the flywheel and its applications is available in ”Kinetic Energy Storage and Mag- netic Bearings : for Vehicular Applications” written by Johan Abrahamsson.

http://uu.diva-portal.org/smash/get/diva2:676303/FULLTEXT01.pdf

Bill of materials for the printed circuit boards is available in the flywheel shared google drive, for in depth specifications of individual components refer to the corresponding datasheet.

2 System overview

The flywheel driveline can be connected in two different ways, either with the flywheel in series or in parallel.

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Flywheel in series

Flywheel in parallel

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Photo of the system with relevant parts labelled

3 Standards

3.1 DSUB pinout

A standard pin configuration is used for all 9-pin DSUB connectors with the exception Flywheel DO Interface which has special configuration due to pin constraints. Below is a 9-pin male connector and a table with the corresponding pin associations.

Pin Function

1 +15 V

2 GND

3 Signal 2

4 GND

5 -15 V

6 +15 V

7 Signal 1 8 Signal 3

9 -15 V

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3.2 Design guidelines for cRIO interface boards

Name Package Position (mm)

X1 M09HP 25x52

X2 M09HP 61x52

X3 M09HP 99x52

X4 M09HP 135x52

X5 F25HP 70.6x8

X5 F37HP 77.5x8

PWR IN con-molex/7395-03 16.51x5.08

H1 3,3-PAD 4.5x55.5

H2 3,3-PAD 155.5x55.5

H3 3,3-PAD 4.5x4.5

H4 3,3-PAD 155.5x4.5

• Miter 4 mm on all corners

• Polygon isolation 0.6096 mm

• Standard capacitor package - 1206

• Standard resistor package - 1206

3.3 Digital Input protection

All digital inputs has R6 which acts as a pull down when nothing is connected it also lowers the input

impedance allowing a small current to flow, this makes the system more noise immune. All inputs has over

voltage protection, a low pass filter and schmitt triggers implemented as in the schematic below.

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4 Interface PCBs

4.1 Digital OUT Interface (NI9401)

The digital OUT interface board communicates with the IGBT board. To do this the interface board converts the 5 V TTL signal to a 15 V signal, this is done with level shifter ICs. 15 V is used to get better noise immunity. It provides switch select and driver enable for each leg. Fault signals is passed on to the DI board via the flat cable connector FAULT OUT. Temperature measurements from the IGBTs internal NTC can also be passed on to an AI board for sampling.

Pin Function 1 Driver enable 1

2 GND

3 +15 V

4 Switch select 2 5 Switch select 1

6 TEMP OUT

7 FAULT 1

8 Driver enable 2

9 FAULT 2

cRIO External device (DSUB) DIO4 X1 - pin 5

DIO5 X1 - pin 4

DIO2 X2 - pin 5

DIO3 X2 - pin 4

DIO0 X3 - pin 5

DIO1 X3 - pin 4

DIO7 X1,X2,X3 - pin 1

DIO6 X1,X2,X3 - pin 8

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4.2 Digital IN Interface (NI9401)

The Digital IN Interface board takes in 15 V digital signals and converts them to 5V TTL compatible with NI9401 module. It also provides ±15 V for powering external equipment.

cRIO External device (DSUB) DIO5 X1 - pin 3

DIO4 X2 - pin 8 DIO6 X2 - pin 3 DIO7 X2 - pin 7 DIO0 X3 - pin 8 DIO1 X3 - pin 3 DIO2 X3 - pin 7 DIO3 X4 - pin 3

Two flat cable connectors is available for passing digital signals between interface boards, DI1 occupies X2

when used and DI2 occupies X3.

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4.3 Analog IN (NI9201)

The Analog IN (NI9201) takes in 8 analog signals and provides adjustable amplification and active filtering.

It also provides ±15 V for powering external equipment. The pin associations can be seen in the table below.

cRIO 9 pin DSUB AI7 X1 - pin 3 AI6 X2 - pin 8 AI5 X2 - pin 3 AI4 X2 - pin 7 AI3 X3 - pin 8 AI2 X3 - pin 3 AI1 X3 - pin 7 AI6 X4 - pin 3

It accepts both voltage and current signals and the mode used is dependant on what resistor is placed on R1 - R8.

If JP1 is used the X2 DSUB will be blocked.

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4.4 Analog IN (NI9205)

The Analog IN (NI9205) takes in 12 analog signals and provides active filtering. It also provides ±15 V for powering external equipment. The pin associations can be seen in the table below.

cRIO External device (DSUB) AI23 X1 - pin 8

AI22 X1 - pin 3 AI21 X1 - pin 7 AI20 X2 - pin 8 AI19 X2 - pin 3 AI18 X2 - pin 7 AI1 X3 - pin 8 AI4 X3 - pin 3 AI3 X3 - pin 7 AI2 X4 - pin 8 AI1 X4 - pin 3 AI0 X4 - pin 7

It accepts both voltage and current signals and the mode used is dependant on what resistor is placed on R1 - R12.

If JP1 is used the X2 DSUB will be blocked.

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5 The power electronics

The power electronics is designed to be modular. Each module consists of 4 IGBTs in H-bridge configuration, heat sink, driver PCBs and decoupling capacitors.

5.1 IGBT

The IGBT used is Infineon F4-75R12MS4.

Relevant specs:

• 1200V, 75A

• H-bridge in one package

• Anti-parallel diodes

• Built in NTC resistor for temperature measurements

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5.2 IGBT PCB

The IGBT PCB is designed to be soldered on top of the IGBT module. Two driver boards are mounted on each card. It contains gate resistors for each IGBT, diode network for active clamping, collector sense resistors and temperature measurement in the module.

5.3 Drivers

The driver core used is Concept 2SC0108T2Ax-17 which is a dual channel driver with 600A/1200V driving

capability. For full specifications see Driver Core - Description & Application Manual.

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5.4 Driver PCB

The driver PCB features dead time adjustment and the possibility to change between direct mode and half

bridge mode.

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6 Measurement systems

All measurement boards are powered from the DSUB-connector and use current signals for noise immunity.

6.1 Voltage

The voltage measurements are based on a hall-effect sensor from LEM called LV25-P. R1 - R4 is used to provide a current corresponding to the voltage on the terminals VIN+ and VIN-. Dimensioning of the resistors is done by choosing a nominal voltage to measure and then determine which values of R1 - R4 results in a 10 mA current at that voltage. In this system R1 - R4 is chosen to 6.2 kΩ, this leads to a nominal voltage of approximately 250 V . Key benefits of using this system is the following:

• Electrical isolation between the measurement system and the high power system.

• Current signals

Boards for one and three measurements is available.

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6.2 Current

The current measurements are based on a hall-effect sensor from LEM called LA55P. Key benefits of using this system is the following:

• Electrical isolation between the measurement system and the high power system.

• Current signals

• Ease of use, no need to put shunt resistor in series.

Boards for one and three measurements is available.

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7 DC power source

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autotransformer and it supplies currents up to 16 A (fused). The circuit diagram is shown below.

V

DC

Autotransf ormer Diode rectif ier M ains input and f uses

For safety an emergency stop system is installed so the user can break the circuit at any time from a safe distance.

8 Useful Links

8.1 Bill of Materials (Requires access to the shared folder)

https://drive.google.com/open?id=1luF3jb0tLllrvzJjyBwOvqdcXfLYi1f8e378x mUerg&authuser=0

8.2 Datasheets

LA55-P (http://www.lem.com/docs/products/la%2055-p%20e.pdf ) LV25-P (http://www.lem.com/docs/products/lv%2025-p.pdf)

Concept driver (https://igbt-driver.power.com/sites/default/files/product document/data sheet/2SC0108T2Ax-17.

pdf)

IGBT module (Infineon website)

Film capacitor (http://www.vishay.com/docs/28163/mmkp386.pdf) Electrolytic capacitor (http://www.farnell.com/datasheets/102474.pdf)

Rectifier diode (http://shop.semikron.com/out/media/ds/SEMIKRON DataSheet SKKD 100 16 SPa 1 5 by SKSK 07897171.pdf)

Differential amplifier (http://www.analog.com/media/en/technical-documentation/data-sheets/AD620.pdf) Level shifter (http://www.ti.com/lit/ds/symlink/cd4504b.pdf)

Schmitt trigger (http://www.ti.com/lit/ds/symlink/cd40106b.pdf )

Variabel transformator DSS-9200 (http://www.tramoetv.se/PDFbroschyrer/061 dss.pdf)

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8.3 Application notes

2SC0108T Description and Application Manual

AN-1101 Application with SCALE-2 Gate Driver Cores IGBT modules explanation

8.4 Eagle PCB files

Eagle schematic and board files

References

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